The Development of a Non-Silver-Based Conductive Adhesive for Use in Flip- Switch Technology Table of Contents

ثبت نشده
چکیده

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

A Roadmap to Low Cost Flip Chip Technology and Chip Size Packaging using Electroless Nickel Gold Bumping

Flip Chip (FC) Technology is gaining an increased level of importance for a variety of applications based on Flip Chip on Board or Flip Chip in Package. The first driving force for the introduction of this Technology was the need to achieve increased speed and performance along with higher I/O count. A breakthrough, however, will be the use of flip chip due to cost reduction. For this aim it is...

متن کامل

Adhesive and Conductive – Inkjettable nano-filled inks for use in microelectronics and microsystems technology

Current technology, Inkjet is an accepted technology for dispensing small volumes of material (50 – 500 picolitres). Currently traditional metal-filled conductive adhesives cannot be processed by inkjetting (owing to their relatively high viscosity and the size of filler material particles). Smallest droplet size achievable by traditional dispensing techniques is in the range of 150 μm, yieldin...

متن کامل

Super Thin Flip Chip Assemblies on Flex Substrates - Adhesive Bonding and Soldering Technology – Reliability Investigations and Applications

Thinned silicon chips with very thin bumps (5-7μm) mounted on flexible substrates open up new dimensions in packaging technologies. The use of flexible substrates enables a large variety of geometric possibilities including folding and bending. Conventional flip chip technology using pick&place and standard reflow processes is not suitable for the assembly of ultra thin components. This is base...

متن کامل

Electrical reliability of electrically conductive adhesive joints: dependence on curing condition and current density

The use of electrically conductive adhesives as interconnection materials in electronic assembly process is increasingly becoming a vital part of the electronics industry. Flip-chip joining technique using conductive adhesives has been identi®ed as a key technology for future electronics assembly and manufacturing. The purpose of the present work is to investigate optimum conditions to achieve ...

متن کامل

Process Modeling and Thermal / Mechanical Behavior of ACA / ACF Type Flip - Chip Packages

Development of flip-chip-on-glass (FCOG) assembly technology using anisotropic conductive adhesive/film (ACA/ACF) is currently underway to achieve fine pitch interconnections between driver IC and flat panel display. Conductive adhesives are characterized by fine-pitch capability and more environment compatibility. Anisotropic conductive adhesive/film (ACA/ACF) is composed of an adhesive resin ...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:

دوره   شماره 

صفحات  -

تاریخ انتشار 2010